Non-dissolving copper plating test device
Both sides can be processed! The material width can be up to 280mm, and the material thickness ranges from 25μm to 50μm.
The device is designed to perform copper plating process tests on the product pattern section of a film foil after undergoing pre-treatment, copper plating, washing, and drying processes, using a roll-to-roll vertical transport method for both sides of the product. The transport speed ranges from 0.1 to 0.5 m/min, with a maximum material width of 280 mm and a material thickness of 25 μm to 50 μm. The device consists of the following stages: unwinding, acidic degreasing, washing 1, feeding, acid activation, copper plating, recovery, feeding, washing 2, pure water wash, squeezing, air knife, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Processing surface: Both sides ■ Utilities: Power supply (AC 200・220V / 50・60HZ), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 5m (L) × 1m (W) × 1.3m (H) *excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
